This year's SEMICON Taiwan highlighted eight key industry themes, including advanced manufacturing, heterogeneous integration, compound semiconductors, automotive chips, smart manufacturing, sustainability, semiconductor cybersecurity, and workforce development. Under the theme "Transform Tomorrow," this year's exhibition brought together more than 1,300 exhibitors across 4,300 booths and attracted over 130,000 industry professionals from 65 countries, setting new records for both exhibitor and booth participation.

Czech Pavillion at SEMICON Taiwan 2026

The exhibition featured more than 50 forums, bringing together 350 domestic and international speakers and attracting over 11,000 attendees. In addition, 120 on-site presentations focused on key topics such as artificial intelligence (AI), advanced manufacturing processes, advanced packaging, silicon photonics, quantum technologies, sustainability, and cybersecurity. The event also facilitated several important collaborations, including the establishment of the SEMI Semiconductor Materials Alliance, a cross-sector partnership with Taiwan High Speed Rail, and a global strategic partnership with Silicon Catalyst, underscoring SEMICON Taiwan’s role as a value-added platform connecting the global semiconductor ecosystem.

Czech Pavillion Opening at SEMICON Taiwan 2026

This year’s Czech delegation featured key players from the semiconductor industry, including HiLASE, Onsemi, SVCS, PBT Works, and TESCAN, alongside the largest Czech academic and research delegation in the semiconductor field ever to visit Taiwan, highlighting the Czech Republic’s strengths in both innovation and talent development.

We have welcomed representatives from Brno University of Technology, Czech National Semiconductor Cluster, Czech Technical University, Liberec Technical University, J.E. Purkyně University in Ústí nad Labem, Innovation Centre of the Ústí Region, Charles University, Technical University of Ostrava, University of West Bohemia in Pilsen, Liberec Business Incubator, University of Chemistry and Technology, and Liberec Regional Development Agency.

Visit to Tamkang University

Our delegation had the opportunity to engage with counterparts working in the fields of IC design, advanced packaging, semiconductor chemicals, and materials. The meetings were conducted in a discussion-oriented format, often organized into thematic groups, which facilitated meaningful exchanges and in-depth discussions on areas of expertise, potential research synergies, and opportunities for future collaboration. A big thank you goes to our academic and research partners in Taiwan for helping us coordinate these meetings and facilitate engaging discussions. These include: National Taiwan University, National Cheng Kung University, National Tsinghua University, Tamkang University, Academia Sinica, and National Taiwan University of Science and Technology.

Visit to National Tsinghua University

Visit to National Cheng Kung University

Moreover, the Czech delegation had the opportunity to attend the European Investment Forum which was organized by the European Economic and Trade Office. A novelty from previous years has been the very first Czechia-Taiwan Business & Academic Forum organized by the Czech Economic and Cultural Office and CzechInvest in cooperation with National Yang Ming Chiao Tung University and business association Teala. The forum has brought together representatives from academia and industry for a series of inspiring seminar sessions regarding milestones in Czechia-Taiwan semiconductor cooperation; talent development; business insights; and EU market and industry opportunities. The forum has demonstrated the increasing emphasis on academia-industry co-creation and the growing need for an academia-industry dialogue.

Czechia-Taiwan Business & Academic Forum

Czechia-Taiwan Business & Academic Forum Seminar

Author: Dominika Urhová, Head of Science and Technology Section, Czech Economic and Cultural Office